发明名称 |
METHOD FOR PLATING MOLDED BODY OF POLYETHYLENE TEREPHTHALATE WITH METAL |
摘要 |
PURPOSE:To simply form a metallic film having superior adhesion by plating with high reproducibility by etching a molded body of polyethylene terephthalate and immersing it in palladium hydrosol contg. a cationic surfactant. CONSTITUTION:A molded body of polyethylene terephthalate is etched by immersion in an aqueous soln. of an alkali metallic hydride for >=about 10min. the molded body is then immersed in palladium hydrosol contg. a cationic surfactant to stick palladium colloid to the surface of the molded body. About 0.002-0.1% stearyltrimethylammonium chloride is preferably used as the surfactant. The palladium hydrosol contains bout 0.1-2mg atom/l Pd and the immersion is preferably carried out at room temp.-about 100 deg.C for >=about 1min. The molded body is pulled up, washed and chemically plated by a conventional method. |
申请公布号 |
JPS621876(A) |
申请公布日期 |
1987.01.07 |
申请号 |
JP19850140789 |
申请日期 |
1985.06.27 |
申请人 |
AGENCY OF IND SCIENCE & TECHNOL;TODA KOGYO CORP |
发明人 |
NAKAO YUKIMICHI;KAERIYAMA KYOJI;SUDA MASAO;IMAI TOMOYUKI;HORIISHI NANAO |
分类号 |
C23C18/20;C23C18/28;C23C18/30 |
主分类号 |
C23C18/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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