| 摘要 |
A floor treating machine adapted to operate as a floor scrubber and a floor polisher or buffer includes a main housing or support frame structure from which extends a brush housing assembly. The main housing contains a combined solution and recovery tank, a motive device to power the floor treating machine, a propulsion system to propel the floor treating machine along the floor, a pneumatic power system, a squeegee subassembly and electrical and pneumatic control systems therefor. The brush housing assembly is operatively connected to the main housing by a brush lifting mechanism such that two brushes selectively rotating in opposite directions in the brush housing assembly can be lifted away from the floor or moved toward the floor so that the brushes exert the correct amount of pressure against the floor depending on the job being done. The electrical and pneumatic control systems enable the floor treating machine to be selectively operated as a floor scrubber wherein the brushes in the brush housing assembly rotate at a relatively slow rotational speed and wherein the amount of pressure that the brushes exert against the floor is adjustable. The control systems also enable the floor treating machine to be selectively operated as a floor buffer or polisher wherein the brushes are rotated at a relatively high rotational speed and the brushes exert a relatively constant force or pressure against the floor. A high speed polisher is also disclosed capable of attaining rotational brush speeds of 2000 RPM and over. The polisher is controlled by an electric and pneumatic control system.
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