| 摘要 |
PURPOSE:To obtain the titled device sealed with a high-reliability, flame- retarding epoxy resin of excellent laser markability, by sealing a semiconductor element with a resin comprising an epoxy resin, a curing agent, a metal complex dye and antimony oxide. CONSTITUTION:A resin-sealed semiconductor device is obtained by sealing a semiconductor element 1, a bed 2, bonding wires 3 and lead pins 4 with a sealer 5 of an epoxy resin composition obtained by mixing an epoxy resin (A) of an epoxy equivalent weight of 170-300, a Cl ion content <=10ppm and a hydrolyzable chlorine content <=0.1wt% (e.g., novolak type) with a curing agent having at least two phenolic hydroxyl groups in the molecule (e.g., novolak phenolic resin) so that the ratio of the number of the epoxy groups of component A to that of the phenolic hydroxyl groups of component B may be 1:0.5-1.5 and further mixing this mixture with 0.01-10wt%, based on component A, metal complex dye (e.g., O,O'-dioxy azo dye) and 0.1-10wt%, based on the resin composition, antimony oxide such as Sb2O4 or Sb2O5. |
