| 摘要 |
An electrical interconnection device intended for interconnecting an array of conductors in a cable to conductors on a substrate is disclosed. The device is comprised of a spring metal member having means securing said device to a substrate, a stamped and formed body with a first and second section joined by an intermediate bight. The first and second sections are mutually relatively deflectable about the bight to a second position and a locking means to retain said device in its second position. Energy is stored in the body in its second position whereby upon positioning the cable conductors between the second body section and the circuitry and deflecting the first section to the second position and engaging said lock, the stored energy is transmitted through the second section to the conductor array to maintain a normal force on the substrate.
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