COMPOSITE COMPACT COMPONENT AND A PROCESS FOR THE PRODUCTION OF THE SAME

摘要

TITLE OF THE INVENTION A composite compact component and a process for the production of the same This invention relates to a composite compact component with a high bond strength between the composite compact and substrate, comprising a composite compact consisting of a diamond or BN compact containing at least 50 % by volume of diamond or BN powder and a base of hard sintered alloy bonded during sintering under an ultra-high pressure and high temperature directly or through an interlayer with a thickness of at most 0.5 mm to the diamond or BN compact, and a substrate bonded to the base of the composite compact, the substrate having a larger volume than the base, in which the substrate is a hard sintered alloy or steel, and the base and substrate are bonded through a high strength metal or alloy, as a filler metal, having a thickness of at most 2 mm and a melting point of at least the liquidus point of the hard sintered alloy.