| 摘要 |
<p>The present invention relates to cooling for electronic power devices. According to the method and the device, which form the subject of the invention, the bases or electrodes of the electronic device 1 are placed in thermal exchange contact with the evaporation exchangers 2 of a two-phase thermosiphon, the device comprising evaporation exchangers 2 in thermal exchange contact with the bases or electrodes of an electronic power device 1, at least one cooled condenser 3 and channels 8 and 9 to convey the vapour generated in each (or the evaporation exchangers 2 to one condenser 3 and to bring the condensate from the or from each condenser 3 to the associated evaporation exchanger or exchangers 2. The invention is applicable especially to cooling power diodes and thyristors. <IMAGE></p> |
