METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD

摘要

A manufacturing method of a printed circuit board is provided to improve process efficiency by performing a hardening process of a first insulation layer and a drying process of the first insulation layer and a circuit pattern at the same time. A seed layer and a plating layer are formed on a first insulation layer(S110). The seed layer and the plating layer are flash-etched in order to form a circuit pattern(S120). The circuit pattern is surface-treated in order to increase an adhesive force between the circuit pattern and a second insulation layer(S130). A hardening process of the first insulation layer and a drying process of the first insulation layer and the circuit pattern are performed in an inert gas atmosphere at the same time(S140). The inert gas includes nitrogen, argon, helium, or combination thereof. The second insulation layer is formed on the first insulation layer in order to cover the circuit pattern(S150).