发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:The titled composition, containing an epoxy resin, novolak type phenolic resin, phenolaralkyl resin and crosslinked polystyrene in a specific proportion and capable of giving cured articles having improved heat-resistant impact resistance and moisture resistance. CONSTITUTION:An epoxy resin composition consisting of (A) 100pts.wt. epoxy resin, preferably having 70-85 deg.C softening point and 170-220 epoxy equivalent, (C) 10-50pts.wt., preferably 20-40pts.wt. novolak phenolic resin as a curing agent, preferably having 80-100 deg.C softening point and 100-110 OH group equivalent, (C) 10-50pts.wt. phenolaralkyl resin, preferably having 85-105 deg.C softening point and 185-235 OH group equivalent and (D) 1-40pts.wt. crosslinked polystyrene, preferably having 1-12mum average particle diameter. The compounding ratio of the components (B) with (C) is preferably 50-90pts. wt. total thereof.</p>
申请公布号 JPS61296023(A) 申请公布日期 1986.12.26
申请号 JP19850136190 申请日期 1985.06.24
申请人 TOSHIBA CORP 发明人 FUJIEDA SHINETSU;HIRAI HISASHI;YOSHIZUMI AKIRA;AZUMA MICHIYA
分类号 C08G59/00;C08G59/62;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/00
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