| 摘要 |
PURPOSE:To obtain a semiconductor device, whose heat dissipating property is excellent, by separately providing a first semiconductor chip and a second semiconductor chip on the same package, and dissipating heat yielded in the semiconductor chip to the outside through a metal member and the like at the time of operation. CONSTITUTION:A silicon IC chip 9 and a gallium arsenide IC chip 8 are provided on the same package 1. In order to arrange both chips 8 and 9 separately, only the gallium arsenide IC chip 8 is fixed on a metal member 4. Heat, which is yielded in the gallium arsenide 8 can be efficiently dissipated to the outside through the metal member 4. When the silicon IC chip 9 is bonded to a transmission line 10 in a face down attitude, the number of wire bondings is decreased, and the high integration density of the silicon IC chip can be implemented. |
