| 摘要 |
PURPOSE:To expand freedom in circuit design, by sequentially laminating an upper wiring layer, an insulating layer, a ferromagnetic layer, an insulating layer and a lower wiring layer on a semiconductor substrate, forming the ferromagnetic layer between the upper and lower wiring layers, and providing positional relationship so as to obtain transformer coupling. CONSTITUTION:On a semiconductor substrate 1, a ferromagnetic layer 5 comprising ferrite and Permalloy is formed between a first wiring layer 3 and a second wiring layer 4 through an insulating layer 2. The first wiring layer 3 and the second wiring layer 4 are formed in a spiral shape or a loop shape. The centers of both layers are made to agree. In this constitution, a transformer is formed by the first wiring layer 3, the ferromagnetic layer 5 and the second wiring layer 4 on the semiconductor substrate. Therefore, a transformer coupling circuit can be provided within the semiconductor integrated circuit device without using an externally attaching method. Thus the freedom in circuit design is improved.
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