| 摘要 |
<p>PURPOSE:To decrease the number of parts and to improve productivity, by using one kind of metal plates, by which a plurality of pellets are bonded, and providing the configuration suitable for mass production. CONSTITUTION:Strip pieces 1 and 2 have an interval (d) and arranged on the same frame 3 with terminal pieces 1a and 2a. The pieces are formed in one metal plate 4 by press blanking. Semiconductor pellets P1-P4 for diodes D1-D4 are soldered and fixed on a metal plate 4', which has the same shape as the metal plate 4 and has the inverted shape. The metal plate 4 is laminated on the metal plate 4' with holes 3a and 3a' as references. The metal plate 4 is soldered to the pellets P1-P4. Then, the strip pieces 4 and 4' are molded with a molding resin 5 as a unitary body. Thereafter, the strip frames 3 and 3' are cut and separated and a semiconductor device 6 is completed. Since the metal plates 4 and 4' have the same shape, the kinds of the parts being used are decreased.</p> |
