发明名称 ELECTRONIC COMPONENT INSPECTING DEVICE
摘要 PURPOSE:To elevate the working efficiency and reliability in the inspection, by utilizing a bag which is sealed with a fluid with limited loss of acoustic propagation as medium means for acoustic connection between electronic components and an acoustic sensor. CONSTITUTION:When carrying out the inspection of foreign matters within an electronic component 1, a package 11 of the electronic component 1 is placed on a vacuum adsorption block 5. Then, air between the block 5 and the package 11 is bled through a vacuum suction hole 52. With such an arrangement, the package 11 is adsorbed and fixed on the side of the block 5 being crushing a bag body 4 sealed with a fluid with limited loss of acoustic propagation. Here, the bag body 4 is squeezed by following the shape of the surface of the package 11 while being deformed freely. Thus, the bag body 4 can be put tight regardless of any bruise eye 12 provided and the package 11 can be acoustically connected very tight onto the sensing surface 21 of an acoustic sensor 2 through the fluid 42, thereby assuring accurate detection of a sound, namely, an ultrasonic wave due to a foreign matter within the package 11.
申请公布号 JPS61292552(A) 申请公布日期 1986.12.23
申请号 JP19850134161 申请日期 1985.06.21
申请人 HITACHI LTD;HITACHI TOBU SEMICONDUCTOR LTD 发明人 ICHIKAWA KIMINORI;IIZAKA SUSUMU;ARAI SHIGERU;CHATANI YUKIHIRO
分类号 G01R31/26;G01N29/04;G01N29/12;G01N29/28;H01L21/66 主分类号 G01R31/26
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