| 摘要 |
PURPOSE:To suppress the curvature of a circuit board after sintering by forming an insulating film which is thicker than a conductive pattern on an unsintered ceramic insulating layer except the conductive pattern. CONSTITUTION:The conductive pattern 4, an I/O pattern 5, and the insulating film 6 are formed on a green sheet 1a. Namely, the conductive pattern 4 is formed on the green sheet 1b, and the conductive pattern 4 and insulating film 6 are formed on the green sheet 1c. The insulating film 6 is made thicker than the patterns 4 and 5. Then, respective sheets 1a-1c are laminated and sintered to obtain a ceramic multilayered printed board. Then, a metallic plate which has a high fusion point is placed on the surface on the side of the conductor pattern 4 and sintered again. Consequently, the curvature after sintering is suppressed. |
