| 摘要 |
PURPOSE:To prevent the phenomena of a wire-flowing and a wire-open on a sealing with a molding resin by forming a projecting section sufficient for protecting a wire bonding section onto an inner lead for a lead frame. CONSTITUTION:Projecting sections 6 are shaped onto inner leads for lead frames 1. It is preferable that a polyimide tape in thickness of 0.5mm or more is used as the projecting section. Since such projecting sections 6 are formed, the pressure of a molding resin agent is reduced on molding sealing, and bonding wires 5 are protected, thus preventing the generation of a wire-flowing and a wire- open. It is desirable that a position where the projecting section 6 is shaped is closed to a bed section 2 as much as possible on the view-point of the protection of the bonding wire 5, but a margin is required to a certain extent on the inside so as not to hinder wire bonding. |
