| 摘要 |
<p>PURPOSE:To obtain a wafer chip having no crack, no damage nor a fissure and excellent characteristics from an extremely thin wafer by cutting the wafer by anisotropical etching with alkaline etchant. CONSTITUTION:A semiconductor wafer 5 obtains a solar battery cell used in space, and an alkaline resistant masking material 8 is disposed at the prescribed positions on both front and back surfaces of the wafer 5. The disposing positions are so provided as to coat the entire front and back surfaces, to independently coat a plurality of front electrodes 4 on the front surface, i.e., to coat the portion corresponding to a solar battery cell shape. An alkaline etchant is contacted at the position 9 between the materials 8 on the front surface of the wafer 5 in this state. The etchant uses aqueous sodium or potassium hydroxide solution. The etching with the alkaline etchant is anisotropic, and the wafer portion contacted with the etchant is resultantly removed vertically to form three independent solar battery cells 10.</p> |
