| 摘要 |
PURPOSE:To improve heat sink characteristic while maintaining insulation by dividing a resin-molded layer into two layers to shorten a distance between a bed and the heat sink, thereby preventing voids from generating and increasing the crystalline silica-content of the resin-molded layer interposed therebetween. CONSTITUTION:After a semiconductor chip 4 is die bonded and wire bonded on a lead frame 3, the first resin-molded layer 31 is formed by transfer molding, and resin-sealed. Then, a heat sink 1 is mounted in a transfer mold, a lead frame formed with the first resin-molded layer is mounted at the prescribed interval on the heat sink, a transfer molding is then achieved to form the second resin-molded layer 32. In the second transfer molding, resin liquid first flows between the heat sink 1 and the first resin-molded layer, and then flows outside the first resin mold. Accordingly, the air escaping place of this case is not the gap between the bed and the heat sink but the second resin-molded layer 32 forming space, thereby eliminating voids in the gap as pointed out above. |
