| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which an optical semiconductor element and a wiring board can be easily conductively connected and light emitted from the optical semiconductor element can be effectively extracted.SOLUTION: The present invention relates to a method for conductively connecting the optical semiconductor element and the wiring board using a die bond material. The die bond material is comprised of a curable resin composition which contains at least one selected from among a silicone resin, a modified silicone resin, an epoxy resin, and a modified epoxy resin and of which the viscosity measured at 25°C and 2 rpm using an E-type viscometer satisfies a range of 10 Pa s or more and 100 Pa s or less, the viscosity measured at 25°C and 50 rpm using the E-type viscometer satisfies a range of 1 Pa s or more and 10 Pa s or less, the full beam permeability in thickness of 2 mm of a cured object at a time when the resin is cured is 80% or more, and the haze value becomes 20% or less.SELECTED DRAWING: Figure 1 |
