| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of suppressing vibration of a semiconductor module and a cooler.SOLUTION: A power conversion device 1 comprises a plurality of semiconductor modules 2, a plurality of coolers 4, a bracket 5 facing the semiconductor modules 2 and the coolers 4, and a case housing them. The plurality of semiconductor modules 2 and the plurality of coolers 4 are laminated so that the coolers 4 are positioned adjacent to the semiconductor modules 2. The bracket 5 includes a fixing member 51 which extends in the lamination direction of the semiconductor modules 2 and the coolers 4, and a support plate 58 which extends from one end of the fixing member 51 and faces the lamination direction. The other end of the fixing member 51 is fixed to the case 7. The plurality of semiconductor modules 2 and the plurality of coolers 4 are held between the support plate 58 of the bracket 5 and a side wall 71 of the case 7 in the state of being compressed in the lamination direction. At least one of the plurality of coolers 4 is fixed to the bracket 5.SELECTED DRAWING: Figure 1 |
