发明名称 MOUNTING STRUCTURE OF ELECTRONIC COMPONENT AND MOUNTING METHOD OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To prevent dust, moisture, corrosive gas, and the like, from flowing between an electronic component and a printed board from a gas vent, after mounting the electronic component, even if the printed board is constituted to have a gas vent.SOLUTION: A mounting structure of electronic component includes a printed board having a terminal insertion hole, an electronic component having a connection terminal, and mounted on the printed board by inserting the connection terminal into the terminal insertion hole and soldering, a gas vent formed in the printed board at a part facing the electronic component, and a sealing member provided to seal the gas vent after mounting the electronic component.SELECTED DRAWING: Figure 1
申请公布号 JP2016111183(A) 申请公布日期 2016.06.20
申请号 JP20140246930 申请日期 2014.12.05
申请人 TOSHIBA SCHNEIDER INVERTER CORP 发明人 FUJITA KENJI
分类号 H05K1/18;H01G2/02;H01G2/06 主分类号 H05K1/18
代理机构 代理人
主权项
地址