发明名称 SPUTTERING DEVICE
摘要 PURPOSE:To permit increase in the size of a target, throwing of large electric power and long-time sputtering by stabilizing and holding the adhered state of a target and backing plate by fixing means for pressing and fixing the target to the backing plate side. CONSTITUTION:The target 21 is adhered by solder, etc., to the backing plate 22 and in this state part of the circumferential edge of the target 21 is detained by a projecting part 262 of a retaining fitting 26 of the fixing means; at the same time the target 21 is pressed to the plate 22 side and is fixed to a base plate 23 of a sputtering electrode. The plate 22 has preferably through-holes 221 and the fitting 26 is fixed to the plate 23 via through-holes 26. The fitting 26 is preferably fixed by means of bolts 27 to the plate 23. The reliability of the adhered state between the target 21 and the plate 22 is improved by such constitution, by which the increase in the size of the targe, the throwing of the large electric power and the long-term sputtering, etc., are attained.
申请公布号 JPS61291970(A) 申请公布日期 1986.12.22
申请号 JP19850133199 申请日期 1985.06.19
申请人 TOSHIBA CORP 发明人 YAMADA TAKASHI;NISHIKAWA REIJI
分类号 C23C14/34 主分类号 C23C14/34
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