| 摘要 |
PURPOSE:To reduce the thermal resistance between a semiconductor chip and the thermal conductor and to remove the heat of the package effectively, by providing with high thermal conductive sheet which contains thermal conductive fluid filling a number of fine through-holes, between the semiconductor chip and the thermal conductor. CONSTITUTION:Between a semiconductor chip 1 and the thermal conductor 12, high thermal conductive sheet 13 is put with being contacted to both of the chip 1 and the conductor 12. The sheet 13 has a number of through-holes 14 which are filled with thermal conductive fluid 18, a number of trenches 16 for communicating the through-holes 14 with one another, and a surrounding trench communicating with the trenches 16 and surrounding the through holes 14. Heat evolved in the semiconductor chip 1 is conducted to the thermal conductor 12 through the sheet 13 being connected to the back face of the chip 1 and the fluid 18, and then is dissipated outwardly from the thermal conductor 12 by cooling medium. Thus the heat of the package can be effectively removed. |
