| 摘要 |
PURPOSE:To prevent an effect on bondability in an assembly process of the contact of a probe for a probe test by separating and severally fitting a pad for bonding and a pad for a test. CONSTITUTION:Pads 7 for a test are formed through short wirings 8 on the reverse sides of wirings 6 connected to internal wirings for bonding pads 3 so that the pads 7 and the pads 3 are unified. On an EPROMIC, a probe test for a test after writing is conducted to the pads 7, and wires 5 are bonded with the pads 3 in an assembly process. Accordingly, bonding having excellent quantity is obtained. |
