| 摘要 |
PURPOSE:To obtain a lead frame having a structure, in which a plurality of semiconductor substrates can be mounted and input signals can be applied separately to each of the mounted semiconductor substrates, and a semiconductor device, which is constituted by using the lead frame and displays the functions of multi- outputs and a single output. CONSTITUTION:A lead frame has structure in which external leads 12 and 13 are lead out of both sides of a rectangular semiconductor substrate support section 11 and six external leads 14-19 are juxtaposed between the external leads 12 and 13. Since the number of the external leads juxtaposed between the external leads 12 and 13 is six, three transistor elements 22, 23 and 24 as the half of six are juxtaposed to the semiconductor substrate support section 11. Each base and emitter electrode in the transistor elements 22-24 and the external leads 14-19 are connected by metallic small-gage wires 25-30, and a section shown by a broken-line frame 31 is sealed with a molding resin, thus completing the manufacture of a semiconductor device. Collectors in the transistor elements 22- 24 are connected in common through the semiconductor substrate support section 11 while being lead out to the outside by the external leads 12 and 13. |
