| 摘要 |
PURPOSE:To obtain a photosensitive composition small in decrease of the thickness of a film formed by using it at the time of baking, good in film flatness, and easy in fine workability at the time of forming films different in sectional shapes, and lower in curable temperature than the conventional ones by incorporating a polystyrylpyridine resin specified in the range of molecular weight in the photosensitive composition together with a photoreactive material. CONSTITUTION:The photosensitive composition contains the polystyrylpyridine having a molecular weight of 500-100,000 and repeating units each represented by formula I, each of R1, R2, R3 being H or 1-8C alkyl, or R1, R2 combining with each other to form a 6-8C aromatic ring, and a photoreactive compound activated with the visible rays, active rays, such as UV-rays or electron beams, such as aromatic compounds, especially, aromatic bisazido compound, embodied by formula II, Q' being -(CH=CH)q''-, -CO-, -N=N-, or the like, or a photopolymerization initiator, such as benzophenone, thus permitting the film obtained by using this photosensitive composition to be easy in microfabrication suitable for the insulating interlayer or its surface protective layer of a semiconductor and so on, and good in film flatness. |
