| 摘要 |
PURPOSE:To do precise and easy screening of semiconductor devices, by forming a fuse circuit for probe-inspection identification on a semiconductor pellet, and by marking the good-or-bad result of the probe inspection by employing cut or non-cut of the fuse circuit. CONSTITUTION:On a semiconductor pellet, a fuse circuit for probe-inspection identification is formed. The fuse circuit is comprised of a polysilicon layer 3 on a field insulating layer 2, a first passivation layer 5 having an opening 4, a wiring layer 6, and a second passivation film 9 having an opening 8 for a pad 7. When an electrical defect is found on any portion of the circuit as a result of the probe inspection, excess current flows across the pad 7 and the ground to melt the fuse circuit, thus identifying defective ones. In this way, precise and easy screening of semiconductor pellets can be done.
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