| 摘要 |
PURPOSE:To eliminate misdecision from the inspection of a soldered zone of a part on a high-density packaged printed circuit board, by irradiating the soldered zone with a slit light containing an excited light scanning it while an image on the background of fluorescence generated from the printed circuit board is detected for a signal processing. CONSTITUTION:First, a command is provided from a total control section 21 and an XY table 19 is moved to the inspection start position to be prepared for the irradiation with a laser beam to a soldered zone to be inspected from an Ar laser 11. Then, the XY table 19 is driven to move a lead section on one side of an object to be inspected of a flat package part 1 to the inspection position and then, a galvanomirror 17 is driven with a slit light of the laser beam kept irradiating the lead section to take a fluorescent image detecting a fluorescent component from the substrate with a linear sensor 18. A processing is done to remove the image of the part place on a printed circuit board near the soldered zone from the photography signal, thereby accomplishing a decision on a defect.
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