| 摘要 |
PURPOSE:To continuously anneal wafers without washing them, by irradiating the wafers with short-wavelength ultraviolet rays for producing ozone and removing the resist on the wafers. CONSTITUTION:A wafer 16 is moved from a cassette loader 15 located on the upstream side of an ultraviolet irradiation section to a belt conveyer 13 with the wafer surface on which a resist is to be adhered directed upwards and is further transferred onto a carrying table 6. The wafer 16 is heated to a predetermined temperature from its rear face by a plate heater 5, while it is irradiated with ultraviolet rays by a ultraviolet lamp 7 from the upside. Simultaneously, the ultraviolet treatment section 12 is continuously supplied with oxygen gas by a gas supply section. The wafers 16 are advanced by a conveyer means by one pitch and moved sequentially to the right-hand direction. The resist on the wafer 16 is completely removed during this movement. The wafers 16 are than introduced through a gate 11 into a buffer section, where they are purged of oxygen. The wafers 16 are transferred to an annealing section, where they are annealed by heating the same with the plate heater 5. |
