发明名称 HEAT TREATMENT FOR SEMICONDUCTOR THIN FILM
摘要 PURPOSE:To enable to favorably perform a heat treatment on a semiconductor thin film utilizing an ultraviolet irradiation annealing method by a method wherein the good ultraviolet absorber is arranged in the vicinity of the semiconductor thin film to be formed on the substrate. CONSTITUTION:An ultraviolet irradiation annealing is applied to a semiconductor thin film (silicon thin film) 4 in a state that a good ultraviolet absorber 2 is arranged in the vicinity of the semiconductor thin film 4, thereby heat absorption into the semiconductor thin film 4 is promoted, the temperature of the semiconductor thin film 4 is made to rise and a heat treatment is applied to the semiconductor thin film 4 with the normal ultraviolet power of the ultraviolet irradiation annealing device. Accordingly an augmentation of the crystal grains of the semiconductor thin film 4 or an activation in the semiconductor thin film 4 in after an impurity is ion-implantated in the semiconductor thin film 4 can be done by an ultraviolet irradiation annealing method.
申请公布号 JPS61289620(A) 申请公布日期 1986.12.19
申请号 JP19850132646 申请日期 1985.06.18
申请人 SONY CORP 发明人 NOGUCHI TAKASHI;MORITA YASUSHI;HAYASHI HISAO
分类号 H01L29/78;H01L21/20;H01L21/26;H01L21/263;H01L21/265 主分类号 H01L29/78
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