| 摘要 |
PURPOSE:To improve performance such as resolution and stability by making the respective heights of a pair of magnetic resistance elements different from each other. CONSTITUTION:After a wafer with a thickness of about 300mum is sliced out from an InSb ingot by a diamond saw or the like, the distortion of the wafer is removed by mirror-polishing. Then the wafer is etched to form grooves as the regions for depositing copper to provide a raster. A photoresist of a required pattern is applied and stripe shape grooves, making a right angle with the longitudinal direction, are engraved on magnetic resistance elements 3 and 4. Then an electrolytic plating is carried out in copper sulfate solution to deposit copper 5 in the grooves. After the photoresist is removed, another photoresist is applied to the InSb wafer and the wafer is etched to the depth deeper than the grooves in order to cut out the shape of the magnetic resistance elements 3 and 4 from the wafer. Therefore, more precise identification is facilitated. |
