| 摘要 |
A laminate, comprising: a carrier film for a transparent conductive film comprising a support and a pressure-sensitive adhesive layer provided on at least one side of the support; and a transparent conductive film comprising a transparent conductive layer and a transparent substrate, wherein the support has an in-plane thermal shrinkage S1 of 0.3 to 0.9% when heated at 140° C. for 90 minutes, and the transparent conductive film has an in-plane thermal shrinkage S2 of 0.3 to 0.6% when heated at 140° C. for 90 minutes. |
