| 摘要 |
The present invention relates to a filter module. The filter module comprises: a substrate; a filter formed on the substrate and connected between an antenna and an amplifier; an amplifier formed on the substrate, connected between the filter and an RF output terminal, and amplifying a signal received from the antenna; a connection part which connects the filter and the amplifier to the substrate; and a cover layer formed on the substrate to cover the filter and the amplifier. The filter and the amplifier are simultaneously packaged in a wafer chip state. As such, the filter module having a small size is able to be provided. |
