发明名称 BONDED SUBSTRATE SHEET AND CONNECTING METHOD OF SUBSTRATE SHEET
摘要 Disclosed are a bonding substrate sheet and a bonding method of a substrate sheet. According to one aspect of the present invention, the bonding substrate sheet comprises: a first substrate sheet fragment including a first unit substrate, a first dummy unit covering the first unit substrate, and a first connection unit connecting the first unit substrate to the first dummy unit; a second substrate sheet fragment including a second unit substrate, a second dummy unit covering the second unit substrate, and a second connection unit connecting the second unit substrate to the second dummy unit; and coupling units separately formed on each one end of the first and second substrate sheet fragments in order to couple the first substrate sheet fragment to the second substrate sheet fragment. According to one aspect of the present invention, when a component is mounted on the bonding substrate sheet, accuracy may be improved.
申请公布号 KR20160080844(A) 申请公布日期 2016.07.08
申请号 KR20140192507 申请日期 2014.12.29
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 JUNG, JOONG HYUK;HEO, KYUNG JIN;LEE, DONG WON
分类号 H05K1/14;H05K3/36 主分类号 H05K1/14
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