发明名称 METHOD OF MEASURING CONTACT STRESS IN CONTACT SURFACE BETWEEN SOLIDS BY ULTRASONIC WAVE
摘要 <p>A method of measuring the contact stress in a contact surface (1) between solids of the same or different kinds by utilizing an ultrasonic wave, consisting of the steps of applying a surface wave to the contact surface (1) from the side of one end thereof so as to introduce the surface wave to the side of the other end of the contact surface (1) therethrough, and determining the contact stress on the basis of the sound pressure of this passed wave as an evaluation index, whereby the contact stress in the contact surface between the parts or members of a machine, which are in the static and dynamic state, can be measured non-destructively, easily, quantitatively, and very accurately by a real-time operation without being influenced by the shape, sizes and roughness of a surface to be flaw-detected, contact surface and bottom surface.</p>
申请公布号 WO1986007452(P1) 申请公布日期 1986.12.18
申请号 JP1985000336 申请日期 1985.06.14
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