| 摘要 |
PURPOSE:To contrive the improvement in heat dissipating efficiency by inserting heat dissipation panels among the chips to enhance a heat dissipating area and projecting the end part of the heat dissipation panel to enhance the heat dissipating area, and further by attaching a heat sink on the side plane of a lamination chip type multilayer semiconductor device. CONSTITUTION:Elements 2 are formed on one side of a semiconductor wafers 1 and another side of this semiconductor wafer 1 is polished to reduce the thickness. Two of such wafers and a metallic plate 3 composing a dissipation panel are bonded mutually by use of a silver paste or the like, thereby forming a set 4 of the semiconductor wafers 1. Then, plural sets of such semiconductor wafer 1 set 4 are bonded to form a wafer laminated body 6 comprising the multilayer semiconductor device sets. This wafer laminated body 6 is sliced by each set of multilayer semiconductor device so as to form a multilayer semiconductor device chip 7. If the semiconductor layer 1 and an insulating layer 5 are removed to project the end part 31 of the metallic plate 3, a heat dissipating area is enhance. Also, if a large heat sink 12 is prepared to be fixed to one of the side planes of the above-mentioned semiconductor device, the heat dissipating effect is further improved. |
