| 摘要 |
PURPOSE:To prevent the loss of electrical characteristics of a circuit forming part by using a horizontal plane in higher position of a bent plate having two horizontal planes which are connected through a step part as a circuit forming part and by using the horizontal plane in lower position as a heat dissipation panel on which the semiconductor pellets generating heat are mounted and fixed. CONSTITUTION:The bent plate 15 is composed of a copper plate and the part of the horizontal plane 13 in higher position near the opposite end to the side of the lower- position horizontal plane 14 is used as the lead pin forming part 17 for forming plural lead pins 16 projecting in the direction separating from the lower-position horizontal plane 14. The part between the lead pin forming part 17 of the higher-position horizontal plane 13 and the lower-position horizontal plane 14 is used as a circuit forming part 24 for forming the circuit composed of four first semiconductor pellets 18-21 composed of diodes, an IC pellet 22, and a chip resistance 23. In the bent plate 15, the lower-position horizontal plane 14 is used as a heat dissipation panel 26 on which the second semiconductor pellet 25 composed of transistor is mounted and fixed. The thickness of the lower position horizontal plane 14 is formed thicker than that of the higher-position horizontal plane 13.
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