| 摘要 |
PURPOSE:To prevent an inner lead from coming into contact with a semiconductor chip causing short-circuit or from breaking a passivation film by a method wherein adsorptive means to adsorption-fix resin films by vacuumizing process are provided in film guides. CONSTITUTION:Film guides 20 to guide the surface of resin films 13 such as polyimide films are formed into adsorptive grooves as adsorptive means 21 to adsorption-fix the resin films 13 by vacuumizing process. A semiconductor chip 11 adsorption-fixed on a table 16 provided with another adsorption groove 15 is bonded to inner leads 14 while bumps 12 made of gold, etc. are fixed on the edge lower surface of inner leads 14. Electrodes 18 made of aluminium, etc. are formed on proper surface of semiconductor chip 11 while the peripheral part thereof is coated with a passivation film 19. The resin films 13 are perfectly fixed in film guides 18 even during bonding process so that the resin films 13 may not be thermally deformed, preventing the inner leads 14 from coming into contact with the semiconductor chip 11 causing short-circuit. |
