| 摘要 |
PURPOSE:To enable to mount a plurality of electronic part chips having excellent heat-radiating property by a method wherein an insulating layer is adhered on both front and back sides of a metal substrate, a circuit conductor is provided on the surface of said insulating layer, a printed wiring board having a metal base is formed, and the electronic part chips are mounted on the printed wiring board. CONSTITUTION:An insulating layer 2 is adhered on both front and back sides of a metal substrate 1, a circuit conductor 3 is provided on the surface of said insulating layer 2, a printed wiring board 4 having a metal base is formed, and an electron part chips 5 are mounted on the front and back sides of the printed wiring board 4 respectively. Besides, the electronic part chips 5 are mounted on both front and back sides of the printed wiring board 4 by wire bonding 17 and the like between the electronic part chips 5 and the circuit conductor 5. As a result, even when heating power is increased owing to the mounting of a plurality of electronic part chips 5, a heat dissipation corresponding to the heating power can be performed, thereby enabling to perform a high-density mounting of a plurality of electronic part chips 5. |
