发明名称 |
EXTENDED DRAIN CONCEPT FOR REDUCED HOT ELECTRON EFFECT |
摘要 |
Hot electron injection into the gate oxides of MOSFET devices imposes limitations on the miniaturization of such devices in VLSI circuits. A buried channel is provided to guard against hot electron trapping effects while preserving process and structure compatibility with micron or submicron VLSI devices. The channel current is redirected into a buried channel at a distance away from the interface in the vicinity of the drain region where the hot electron effect is most likely to occur. This redirection is effected by providing a buried, lightly doped region extending inwardly from the conventional source and drain implant profile regions. |
申请公布号 |
EP0197501(A3) |
申请公布日期 |
1986.12.17 |
申请号 |
EP19860104512 |
申请日期 |
1986.04.02 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
WEI, CHING-YEU;PIMBLEY, JOSEPH MAXWELL |
分类号 |
H01L21/336;H01L29/78;(IPC1-7):H01L29/08;H01L29/36;H01L21/265;H01L21/00 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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