| 摘要 |
PURPOSE:To shut off the moisture coming from a wiring board and affecting an electronic part chip by a method wherein a wiring board is formed by providing a circuit conductor on the surface of an insulated substrate, a recess to be formed by performing a cutting work is provided on the surface of the wiring board, a metal-plated layer is formed, and the electronic part chip is mounted in the recess. CONSTITUTION:A printed wiring board 3 is formed in such a manner that a circuit conductor 2 is provided on the surface of an insulated substrate 1, and a recess 4 which serves as the cavity to be used for mounting of an electronic part chip 7 by performing the cutting work using a spot facing formed by machining is provided on the surface of wiring board 3. A coating layer 5 is formed on the inner surface of the recess 4, and a metal-plated layer 6 is formed on the surface of the coated layer 5 by providing a metal-plated layer. It is necessary that the coating layer 5 is formed using the material with which a plating solution can be shut off, and said layer 5 is hardened by coating the resin such as epoxy resin and the like. The plating solution is shut off by the coated layer 5, and the infiltration of the plating solution into the internal part of the insulated substrate 1 can be prevented. The electronic part chip 7 is mounted, a wire bonding 12 and the like is provided between the electronic part chip 7 and the circuit conductor 2, and the electronic part chip 7 is mounted on the printed wiring board 3. |
