| 摘要 |
<p>PURPOSE:To dissipate the heat generation of an electronic part chip excellently by laminating and bonding an insulating substrate, to which a through-hole is formed, onto the surface of a metallic substrate in metallic base laminated plates through an adhesive insulating layer while laminating a metallic foil onto the surface on the reverse side and blocking the base of the through-hole for the insulating substrate by the metallic substrate to shape a recessed section. CONSTITUTION:A metallic foil 3 is laminated onto one surface of a metallic substrate 1 through an insulating layer 2 to prepare a metallic base laminated plate 4, and an insulating substrate 6 to which a through-hole 5 is shaped is laminated and bonded onto the surface of the metallic substrate 1 in the metallic base laminated plate 4 through an adhesive insulating layer 7. A metallic foil 8 is laminated onto the surface on the side reverse to the metallic substrate 1 of the insulating substrate 6, and the base of the through-hole 5 for the insulating substrate 6 is blocked by the metallic substrate 1 to form a recessed section 10 for mounting an electronic part chip 9. One part of the substrate for a printed wiring board as a chip carrier is shaped by the metallic substrate 1 having excellent thermal conductivity and heat dissipating properties are improved, and the recessed section 10 is formed by the through-hole 5 shaped to the insulating substrate 6, thus eliminating the need for the machining of spot facing.</p> |
