| 摘要 |
PURPOSE:To improve a linear bonding strength and to always stably cut at neck in damage mode by slightly inclining a substrate at opposite side with the edge line of a semiconductor chip placing surface and a linear bonding pad surface as a boundary. CONSTITUTION:A substrate 1 of ceramics is lightly inclined to the opposite side with an edge line of a chip placing surface 1a and a linear bonding pad surface 1b as a boundary. Thus, since the contacting area gradually increases in the bond of aluminum wirings 3 during supersonic beam bonding, the bonding strength remarkably increases. The collapsed part 3a of the chip 2 side and the collapsed part 3b of the pad surface 1b side are reduced in thickness at both edge line sides, and when the wirings 3 are pulled upward, the damage modes of the parts 3a, 3b are hardly separated, but always tend to cut at neck, thereby readily controlling the quality of the bonding. |
