INNER LEAD BONDING DEVICE

摘要

PURPOSE:To prevent the defects in inner leads both short-circuiting to a semiconductor and giving damage to a passivation film by a method wherein a pair of holders holding inner leads or resin films are arranged on the periphery of a semiconductor chip making the top level of holders higher than the top level of semiconductor chip. CONSTITUTION:A pair of holders 10 encircling a semiconductor chip 11 are arranged on a table 16 provided with an adsorptive groove 15 to adsorb the semiconductor chip 11. The holders 10 are formed higher than the level of bumps 12 while inner leads are held by the edges of holders 10 not to bring the inner leads 14 into contact with the edges of semiconductor 11 when the semiconductor 11 is bonded by a bonding tool 17. Through these procedures, the defects in inner leads 14 both coming into contact with the semiconductor chip 11 causing short-circuit and giving damage to a passivation film 19 on the semiconductor chip 11 can be prevented from happening.