| 摘要 |
PURPOSE:To prevent a shortcircuit between adjacent leads from occurring by bonding in advance a solder for mounting to a lead part. CONSTITUTION:A solder piece 5 is thermally press-bonded to a blank plate of a lead frame 1, and allowed to remain at the external intermediate position of bent wirings 4 or leads 3. The quantity of a solder is equal to or slightly larger than the inner volume of a through hole of a printed board. According to the construction, when the solder 5 is melted to bond the leads to the board, the solder 5 is prepared in the prescribed amount, thereby preventing adjacent leads from shortcircuiting. |
