| 摘要 |
<p>Cooling device for semiconductor components, including a chamber for receiving semiconductor components, boiling liquid disposed in the chamber for immersing the semiconductor components, means connected to the aid chamber for supplying a cooling air to eliminate a temperature rise of the aid boiling liquid and to remove a maximum power loss at a normal maximum ambient temperature, a thermal energy accumulator connected to the chamber, and means for switching off the aid cooling air supply means and switching on the thermal energy accumulator if the ambient temperature of the cooling air rises.</p> |
