| 摘要 |
<p>Partially advanced epoxy resin compsn. in the reaction prod. of (A) relatively low equiv. wt. epoxy resin(s) having an ave. of more than 1 vicinal epoxy gp. per molecule; (B) extender material(s) having an ave. of 2 active H per molecule reactive with vicinal epoxy gps.; and (c) at least one of: (C1) catalyst(s) for promoting the reaction between (A) and (B); (c2) epoxy resin curing agent(s); or (c3) combination of (c1) and (c2). (A), (B) and (C) are present in quantities which provide: 0.1-0.9 active H equivs. in (B) per epoxide equiv. in (A); 0.05-0.9 equiv. of (c2) per epoxide equiv. in (A) and the combined equivs. of (B) and (c2) per epoxide equiv. of (A) is 0.15:1-1.1:1; and on 0-0.1 mol. of (c1) per equiv. of epoxide in (A). The novelty isthat the compsn. is partially advanced in the absence of a solvent to the extent that the melt viscosity (MV) is at least 20% higher than that of the initial mixt. of (A), (B) and (C) and that the compsn. is melt flowable at or below 25 deg.C. Cured prod. contg. the compsn. is also claimed.</p> |
