发明名称 |
Mechanical locking between multi-layer printed wiring board conductors and through-hole plating |
摘要 |
A plated through-hole conductor structure for a multiple layer laminate electronic printed wiring board includes mechanical locking of the plated through conductor with textured conductor surfaces together with use of etching or other processing to provide laminate internal space for the mechanical locking structure. A manufacturing sequence and plural material selections are also disclosed.
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申请公布号 |
US4628598(A) |
申请公布日期 |
1986.12.16 |
申请号 |
US19840657097 |
申请日期 |
1984.10.02 |
申请人 |
THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE |
发明人 |
TAYLOR, EDWARD |
分类号 |
H05K3/00;H05K3/38;H05K3/42;H05K3/46;(IPC1-7):H05K3/42 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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