发明名称 |
High density IC module assembly |
摘要 |
An electronic module having a high density of silicon IC chips is provided by mounting the chips in tapered through-holes in a silicon substrate, filling the edge gaps between the chips and the substrate with a glass so that the chips, the filler glass, and the substrate have a smooth upper surface adapted to receive monolithic interconnections formed by planar metallization methods. The resulting assembly is enclosed in a housing also formed substantially from silicon, which contains electrically isolated pins for contacting the input-output electrodes of the assembly. Preferential etching is used to form the through-holes in the substrate as well as various alignment means on the substrate and other parts of the housing so that they are self-aligning during assembly. Improved performance, reliability, and low cost is obtained.
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申请公布号 |
US4630096(A) |
申请公布日期 |
1986.12.16 |
申请号 |
US19840615499 |
申请日期 |
1984.05.30 |
申请人 |
MOTOROLA, INC. |
发明人 |
DRYE, JAMES E.;SCHROEDER, JACK A.;WINCHELL, II, VERN H. |
分类号 |
H05K3/30;H01L23/053;H01L23/14;H01L23/538;H01L25/04;H01L25/18;H01L29/06;(IPC1-7):H01L23/12;H01L23/18;H01L23/40 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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