| 摘要 |
An apparatus including a first package coupled to a second package, wherein each of the first package and the second package has a first side and an opposite second side; a first die coupled to the first package; and a second die coupled to the second side of the second package, wherein the first package is coupled to the second package in a stacked arrangement such that the first side of the second package faces the second side of the first package. A method including coupling a first package to a second package in a stacked configuration, wherein the first package includes a first package substrate and a first die and the second package includes a second package substrate and a second die, wherein the second die is disposed on a side of the second package substrate opposite the first package substrate. |
