| 摘要 |
PURPOSE:The titled material, obtained by incorporating an organopolysiloxane with a bicyclic amidine compound and having improved heat cycle resistance, electrical insulating properties and moldability. CONSTITUTION:An epoxy resin molding material containing an organo polysiloxane and a bicyclic amidine compound. An organopolysiloxane having >=1 epoxy groups in one molecule is used as the organopolysiloxane, and incorpo rated to give 0.1-10wt% based on the total amount. The bicyclic amidine compound is incorporated in an amount of 0.1-10wt% based on the total am ount. A polyfunctional epoxy resin having >=2 epoxy groups in one molecule is used as the epoxy resin.
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