发明名称 Planar penning magnetron sputtering device
摘要 An improved magnetron sputter source particularly suitable for magnetic materials is provided in the forming of an unfolded Penning discharge source. The two cathodes are in the form of an inner cathode roughly coplanar with an outer cathode ring. An anode radially between the cathodes is raised above the cathode surfaces so as to block line of sight from the inner cathode surface to the outer. A magnetic flux vector is imposed which passed from one cathode surface to the other. Raising the anode surface about one-fourth inch above the cathode surfaces allows raising the applied voltage so that a source of 5 kilowatts or greater is possible. Raising the anode also spreads the distribution of discharge more uniformly over the target surface and permits low pressure operation thereby facilitating good adhesion and uniform coverage of the substrate.
申请公布号 US4629548(A) 申请公布日期 1986.12.16
申请号 US19850719182 申请日期 1985.04.03
申请人 VARIAN ASSOCIATES, INC. 发明人 HELMER, JOHN C.
分类号 C23C14/36;C23C14/35;H01F41/18;H01J37/34;(IPC1-7):C23C15/00 主分类号 C23C14/36
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